Azure Modeling and Simulation Workbench Alliance enables innovation for semiconductor design

June 24

Earlier this year, Microsoft announced the public preview of the Azure Modeling and Simulation Workbench (Azure MSWB), a groundbreaking service on the Azure Cloud built to revolutionize collaborative development in semiconductor design. This new service leverages the performance, scalability and elasticity of Azure Compute and Azure NetApp Files along with decades of semiconductor experience from both Microsoft and its partners. Azure MSWB enables customers to easily and quickly deploy secure chambers, enabling collaboration scenarios ranging from joint debug, co-development and complex multi-vendor design flows.

Azure MSWB is production proven, creating the foundation of the secure cloud platform for the Department of Defense’s Rapid Assured Microelectronics Prototyping (RAMP) Program. Azure MSWB’s performance demonstrated the robustness and capabilities necessary for the DoD’s contractors to develop leading edge Microelectronics solutions using commercial tools while providing the required level of security and compliance for defense programs. To enable this transformation for the department of defense, Microsoft worked with their partners in the semiconductor industry to jointly develop the RAMP platform capability for the microelectronics community to successfully tape-out silicon programs. This partnership approach ensured that this new solution addressed the real-world requirements of advanced node semiconductor design.

To bring these capabilities to the broader semiconductor industry and help customers unlock the benefits of secure collaborative computing on the cloud, today, Microsoft is launching the Azure Modeling and Simulation Workbench Alliance Program. This program brings the key industry partners together and enables a robust ecosystem around Azure MSWB, facilitating an easily deployable partner-approved design environment where designers can not only create semiconductor products but also collaborate securely with their EDA vendors, IP providers, foundry partners, and design services providers.

Microsoft is proud to announce Cadence, Intel, NetApp, Siemens, and Synopsys as the initial members of the Azure Modeling and Simulation Workbench (Azure MSWB) Alliance Program. We look forward to collaborating with our Alliance Program members to enable their solutions on MSWB, and ensuring our customers have seamless access to support from both Microsoft and their tool/IP vendors. This collaboration is set to streamline the design process, reduce adoption barriers, enhance security, and foster innovation in the semiconductor industry.

Join us at the 61st Design Automation Conference in San Francisco, CA on June 24-26. At this event, you will have the opportunity to learn more about the alliance program as well as Azure MSWB, a powerful tool that will revolutionize the way we approach design and automation. We have a team ready to meet with you (request a 1:1 meeting here) and we also have an exciting lineup of presentations by our team as well as our Alliance members and partners, including a not-to-be-missed hands-on tutorial on Azure MSWB. We hope to see you there and we look forward to sharing this exciting development with you in person, however if you aren’t able to make the event, you can always sign up to stay up to date on our latest news and announcements here or request a virtual meeting here.

Exhibitor Forum, Level 1 Exhibit Hall

Monday, June 24, 10:30AM-11AM PDT

Secure Collaboration Across Enterprises on the Cloud

Prashant Varshney, Head of Product, Silicon Industry, Strategic Missions and Technologies, Microsoft

Azure Modeling and Simulation Hands-on Training, Level 2 Lobby

Tuesday, June 25, 10:15AM-1:15PM PDT

Setting Up a Secure, Turn-Key Cloud-Based Engineering Environment for Semiconductor Development, Collaboration and Debug with Azure Modeling and Simulation Workbench

Prashant Varshney, Head of Product, Silicon Industry, Strategic Missions and Technologies, Microsoft

Preetish Sinha, Silicon Industry, Strategic Missions and Technologies, Microsoft

Joe Tostenrude, Silicon Industry, Strategic Missions and Technologies, Microsoft

DAC Booth schedule

Monday
11:00AM	[attachment=55304:name]	Optimizing Chip Design with Siemens EDA Cloud Solutions and Microsoft Azure
1:00PM	[attachment=55305:name]	Soar to New Productivity Heights with Cloud
2:00PM	[attachment=55306:name]	Synopsys Cloud and Azure: Unleashing the Power of AI and Cloud to Accelerate Your Chip Design
3:00PM	[attachment=55307:name]	EDA in the Azure Cloud with NetApp
4:00PM	[attachment=55308:name]	Secure Collaboration in Semiconductor Design

Tuesday
10:15AM	[attachment=55309:name]	Is the Untapped Power of IP-driven methodologies in Azure your secret to a Competitive Advantage?
11:00AM	[attachment=55310:name]	EDA in the Azure Cloud with NetApp
1:00PM	[attachment=55311:name]	Secure Collaboration in Semiconductor Design
2:00PM	[attachment=55312:name]	Ansys Semiconductor Products on Microsoft Azure
3:00PM	[attachment=55313:name]	Intel Foundry and Microsoft Azure - Systems Foundry for the AI Era
4:00PM	[attachment=55314:name]	Simulation Compute Optimization Across Cost, Time-To-Market, and Emissions

Wednesday
10:15AM	[attachment=55315:name]	Secure Collaboration in Semiconductor Design